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60 Series, Sterling SIPT-old

60 Series, Summit SIPT

  • Summit Interface

SG$ 33.52

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Lead Time : 24.0 weeks

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60 Series, Summit SIPT


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Laird Connectivity

Laird Connectivity simplifies the enablement of wireless technologies with market-leading wireless modules and antennas, integrated sensor and gateway platforms, and customer-specific wireless solutions. Our best-in-class support and comprehensive engineering services help reduce risk and improve time-to-market. When you need unmatched wireless performance to connect electronics with security and confidence, Laird Connectivity delivers — no matter what.


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Overview

Powered by the powerful NXP 88W8997 chipset, Laird Connectivity’s 60-SIPT WiFi + Bluetooth module achieve the best possible connectivity and performance in any RF environment. With industry-leading software, broad OS support, and multiple form factors, Laird Connectivity’s 60 Series offers flexibility to meet your needs. The 60 Series introduces 802.11ac, 2x2 MU-MIMO, and Bluetooth 5.1 on one low-power module, delivering future-ready cutting-edge technology for your product. Building on the security and robustness inherited from Laird Connectivity’s expertise in its 40, 45, and 50 Series modules mean ultra-high data rates, improved performance, and the most reliable wireless in crucial applications such as medical and industrial.

Features


  • BRING WI-FI + BLUETOOTH TO EVEN MORE DEVICES

  • 60 Series modules are supported on Linux® and Android™*

  • REDUCED POWER CONSUMPTION

  • 28nm process technology results in significant power savings over competitive radios

  • CONNECT AT ULTRA-HIGH DATA RATES

  • With 802.11ac and 2x2 MU-MIMO, 60 Series can achieve data rates up to 866 Mbps

  • ALWAYS CONNECTED, EVEN IN THE HARSHEST CONDITIONS

  • 802.11r + CCKM* support for rapid roaming and 2x2 MU-MIMO for improved performance and reliability

  • MULTIPLE FORM FACTORS TO SUIT DIVERSE NEEDS

  • Available as a SiP or M.2 (USB or SDIO) form factors 

  • ROBUST SECURITY FOR ENTERPRISE DEMANDS

  • Full list of security standards and EAP types*

  • BROAD CERTIFICATION AND INTERNATIONAL APPROVALS

  • Certifications and approvals for FCC (USA), ISED (Canada), EU (Europe), KC (Korea), Giteki (Japan), RCM (AUS/NZ)

  • PERSONAL SUPPORT FROM DESIGN TO MANUFACTURE

  • Industry-recognized integration and support organization dedicated to reducing your time to market

Applications

Specifications for 60 Series, Sterling SIPT-old

Summit Interface SIPT
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Powered by the powerful NXP 88W8997 chipset, Laird Connectivity’s 60-SIPT WiFi + Bluetooth module achieve the best possible connectivity and performance in any RF environment. With industry-leading software, broad OS support, and multiple form factors, Laird Connectivity’s 60 Series offers flexibility to meet your needs. The 60 Series introduces 802.11ac, 2x2 MU-MIMO, and Bluetooth 5.1 on one low-power module, delivering future-ready cutting-edge technology for your product. Building on the security and robustness inherited from Laird Connectivity’s expertise in its 40, 45, and 50 Series modules mean ultra-high data rates, improved performance, and the most reliable wireless in crucial applications such as medical and industrial.

Available as the ST60-SIPT.

Specifications

Wi-Fi Spec
802.11 a/b/g/n/ac
Dimensions (L x W x H)
13 mm x 14 mm x 1.87 mm
BT Capable
5.1
Android
Yes
BT Chipset
Combo
BT Dual Mode
Yes
BT Interfaces
UART/SDIO/USB
Data Rate
up to 866 Mbps
Line
Professional
Linux
Yes
Spatial Streams
MU-MIMO
Supplicant
EAP
Temp Spec
-30C +85C
Wi-Fi Chipset
NXP 88w8997
Wi-Fi Interfaces
SDIO/USB/PCIE